Adhesion of substrate-adherent combinations for early composite repairs: Effect of intermediate adhesive resin application

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Ozcan M., Kojima A. N., Pekkan G., Melo Mesquita A. M., Bottino M. A.

INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, vol.49, pp.97-102, 2014 (SCI-Expanded) identifier identifier


This study evaluated the effect of intermediate adhesive resin application (IAR) on tensile bond strength (TBS) for early composite repairs in situations where substrate and repair composite bonded together were once of the same kind with the substrate (similar) and once other than the substrate material (dissimilar). Specimens from three types of composites (TPH Spectrum (TPH), Charisma (CHA) and Filtek Z250 (Z250)) were fabricated. The specimens in each composite group (n=72) were randomly divided into six subgroups (n=12). In each composite group, the similar and two dissimilar composites were bonded onto the substrates once using an IAR (Adper Single Bond Plus) and once without. After water storage for I week at 37 degrees C, substrate-adherent combinations were submitted to tensile test. Data were analyzed with three-way ANOVA and Tukey's tests (alpha=0.05). The substrate-adherent combination (p=0.0001), adherent (repair) composite (p=0.0001), and application of IAR (p=0.0001) significantly affected the results. Utilization of IAR improved the repair bond strength for all composite combinations. (C) 2013 Elsevier Ltd. All rights reserved.